SMT red glue is certain type of temperature-set adhesive that is used during the SMT process to fix certain components to the board in circumstances where they might lose connection or fall off before solder reflow takes place. This red glue is a low temperature curing single pack SMT component bonding adhesive which cures at a very low temperature as low as 80°C . The adhesive can be applied by syringe or by stencil printing Syringes are designed for standard Leur lock Semco Dispensing needles Hardens in less than 60 seconds at 150°C Single pack epoxy resin gives exceptional strong bond strength Meets the requirements of IPC SM817 Typical Curing time: 80°C 200 – 230 seconds 100°C 70 – 100 seconds 120°C 50 – 80 seconds 150°C 35 – 65 seconds
